Photosensitive ink for rigid PCBs

　　Core Application Scenarios and Performance Matching

　　(一) Consumer Electronics Field

　　Mobile Phone Motherboard

　　Ink Selection: Acrylic photosensitive solder mask ink (thickness 40-60μm);

　　Performance Requirements:

　　Waterproof Rating: IPX7 (no penetration at 1 meter depth for 30 minutes);

　　Sweat Corrosion Resistance: Adhesion retention rate >95% in pH 4.5-5.5 environment.

　　Smartwatch

　　Technical Solution: UV-cured organic silicone (light transmittance >90%);

　　Advantages: Balances screen optical performance and button sealing, resistant to sweat erosion (containing 0.9% NaCl).

　　(二) Automotive Electronics Field

　　Vehicle ECU

　　Ink System: Polyurethane photosensitive solder mask ink;

　　Key Performance:

　　Temperature Range: -40℃~150℃ (passed ISO 16750-3 vibration test);

　　Solder Joint Protection: Fatigue life extended by 2 times (20-2000Hz, 20g acceleration).

　　New Energy Battery BMS

　　Material Innovation: Nano-modified organic silicone (thermal conductivity 0.8W/m・K);

　　Function: Conducts heat away from the circuit board, reduces operating temperature by 15℃, and improves battery pack safety.

　　(三) Industrial and Communication Fields

　　5G Base Station RF Board

　　Ink Characteristics:

　　Low Dielectric Loss: Dielectric constant 2.5-3.0 (10GHz), suitable for millimeter-wave frequency bands;

　　Thermal Stability: Long-term operating temperature <180℃, avoiding signal attenuation.

　　Aerospace Equipment

　　Special Requirements:

　　Radiation Resistance: Polyimide-modified ink can withstand a dose of 10⁶Gy;

　　Low Stress: Young's modulus 0.1-0.3MPa, absorbs vibration energy to prevent solder joint fracture.